17

ICs

SI-8000JD Series

■External Dimensions (TO263-5)

(Unit : mm)

Pin Assignment

e GND

t ON/OFF

Plastic Mold Package Type

Flammability: 94V-0

Product Mass: Approx. 1.48g

(2

×R0.45)

(1.7

±0.25

)

(1.7

±0.25

)

0.8

±0.1

10.0

±0.2

(4.4)

(8.0)

9.9

±0.2

Case temperature

measurement point

(15

°)

(0.5)

2-R0.3

10.0

±0.02

3-R0.3

(R0.3)

(R0.3)

0.88

±0.10

1.5 Dp:

±0.2

φ

(1.7

±0.25

)

12345

(1.7

±0.25

)

0.8

±0.1

4.5

±0.2

1.3

0.10

±0.15

2.4

±0.2

+0.10

–0.05

(3

°)

(3

°)

(3

°)

(3

°)

(3

°)

0 to 6

°

■Block Diagram

■Typical Connection Diagram

4

3

GND

2

ON/OFF

1

5

PReg.

OCP

Reset

OSC

+

–

Comp.

Error Amp.

Latch &

Drive

TSD

ON/OFF

Soft

Start

+

–

Di

L1

GND

ON/OFF

GND

SI-8000JD

12

4

3

5

+

+

GND

■Reference Data

Copper Laminate Area on Glass Epoxy Board vs.

Thermal Resistance (Junction to Ambient Air) (Typical Value)

Output Current vs. Power Dissipation (Typical)

55

50

45

40

35

30

2.6

2.4

2.2

2.0

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0

0

200

0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

400

600

800

1000

20V

30V

40V

1200

1400

1600

1800

With glass epoxy board of 40 × 40 mm

The efficiency depends on the input voltage and the output current. Therefore, obtain the value

from the efficiency graph and substitute the percentage in the formula above.

ηχ : Efficiency (%)

3.5

3

2.5

2

1.5

1

0.5

0

–25

0

25

50

75

100

125

Copper Area

40×40 mm

( j-a : 33.3°C/W)

20×40 mm

( j-a : 37°C/W)

20×20 mm

( j-a :44°C/W)

10×10 mm

( j-a : 53°C/W)

θ

θ

θ

θ

100

ηχ