REV. 0

ADG3247

–3–

ABSOLUTE MAXIMUM RATINGS

*

°C, unless otherwise noted.)

Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

LFCSP Package

θ

°C/W

TSSOP Package

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the opera tional

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADG3247 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

Table I. Pin Description

Mnemonic

Description

BEx

Bus Enable (Active Low)

SEL

Level Translation Select

Ax

Port A, Inputs or Outputs

Bx

Port B, Inputs or Outputs

Table II. Truth Table

BEx SEL* Function

LL

A = B, 3.3 V to 1.8 V Level Shifting

LH

A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting

HX

Disconnect

± 10%

PIN CONFIGURATION

40-Lead LFCSP and 38-Lead TSSOP

PIN 1

INDICATOR

TOP VIEW

ADG3247

1

2

3

4

5

6

7

8

9

10

NC = NO CONNECT

30 B0

29 B1

28 B2

27 B3

26 B4

25 B5

24 B6

23 B7

22 B8

21 B9

A6

A7

A8

A9

A10

A11

A12

A13

A14

A15

TOP VIEW

(Not to Scale)

38

37

36

35

34

33

32

1

2

3

4

5

6

7

A0

A1

A2

A3

A4

A5

BE1

BE2

SEL

B0

B1

B2

B3

ADG3247

31

30

29

8

9

10

A6

A7

A8

B4

B5

B6

28

27

11

12

A9

A10

A11

A12

A13

A14

A15

B7

B8

26

25

B9

B10

B11

B12

B13

B14

B15

24

23

22

17

21

20

18

19

GND

NC

13

14

15

16

NC = NO CONNECT

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADG3247BCP

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-40

ADG3247BCP-REEL7

–40

°C to +85°CLead Frame Chip Scale Package (LFCSP)

CP-40

ADG3247BRU

–40

°C to +85°CThin Shrink Small Outline Package (TSSOP)

RU-38

ADG3247BRU-REEL7

–40

°C to +85°CThin Shrink Small Outline Package (TSSOP)

RU-38