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CPQ166 Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part # CPQ166
Description  25 Amp, 600 Volt TRIAC Chip
PDF  1 Pages
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Manufacturer  CENTRAL [Central Semiconductor Corp]
Direct Link  http://www.centralsemi.com
Logo CENTRAL - Central Semiconductor Corp

CPQ166 Datasheet(HTML) 1 Page - Central Semiconductor Corp

  CPQ166 Datasheet HTML 1Page - Central Semiconductor Corp  
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GEOMETRY
PROCESS DETAILS
PRINCIPAL DEVICE TYPES
CQDD-25M Series
CQ220-25M Series
CQ220-25MFP Series
GROSS DIE PER 4 INCH WAFER
373
PROCESS
CPQ166
TRIAC
25 Amp, 600 Volt TRIAC Chip
Process
GLASS PASSIVATED MESA
Die Size
165 x 165 MILS
Die Thickness
9.1 MILS ± 0.4 MILS
MT1 Bonding Pad Area
134 x 100 MILS
Gate Bonding Pad Area
28 x 28 MILS
Top Side Metalization
Al - 45,000Å
Back Side Metalization
Al/Mo/Ni/Ag - 32,000Å
www.centralsemi.com
R1 (29-April 2010)


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