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CPD107 Datasheet(PDF) 1 Page - Central Semiconductor Corp |
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CPD107 Datasheet(HTML) 1 Page - Central Semiconductor Corp |
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1 / 2 page  GEOMETRY PRINCIPAL DEVICE TYPE CZSH6-100C GROSS DIE PER 5 INCH WAFER 5,516 PROCESS CPD107 Schottky Rectifier 3 Amp Schottky Rectifier Chip PROCESS DETAILS Die Size 56 x 56 MILS Die Thickness 11.8 MILS Anode Bonding Pad Area 51 x 51 MILS Top Side Metalization Al - 30,000Å Back Side Metalization Ag - 20,000Å www.centralsemi.com R0 (1-March 2011) |
Similar Part No. - CPD107 |
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Similar Description - CPD107 |
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