CPD76X datasheet(1/2 Pages) CENTRAL

Part #	CPD76X

Description	1 Amp Schottky Diode Chip

PDF	2 Pages

Scroll/Zoom	100%

Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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1 / 2 page

GEOMETRY

PROCESS DETAILS

PRINCIPAL DEVICE TYPES

CMLSH1-40

CXSH-4

CTLSH1-40M832D

GROSS DIE PER 5 INCH WAFER

16,276

PROCESS CPD76X

Schottky Diode

1 Amp Schottky Diode Chip

Process

EPITAXIAL PLANAR

Die Size

32 x 32 MILS

Die Thickness

5.9 MILS

Anode Bonding Pad Area

27 x 27 MILS

Top Side Metalization

Al - 20,000Å

Back Side Metalization

Au - 12,000Å

www.centr a lsemi.com

R2 (22-March 2010)

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