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CPD30V Datasheet(PDF) 1 Page - Central Semiconductor Corp

Part # CPD30V
Description  Dual Switching Diode
PDF  2 Pages
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Manufacturer  CENTRAL [Central Semiconductor Corp]
Direct Link  http://www.centralsemi.com
Logo CENTRAL - Central Semiconductor Corp

CPD30V Datasheet(HTML) 1 Page - Central Semiconductor Corp

  CPD30V Datasheet HTML 1Page - Central Semiconductor Corp CPD30V Datasheet HTML 2Page - Central Semiconductor Corp  
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PROCESS CPD30V
Dual Switching Diode
Dual, Common Cathode,
High Speed Switching Diode Chip
GEOMETRY
PROCESS DETAILS
PRINCIPAL DEVICE TYPE
CMLD2838
GROSS DIE PER 4 INCH WAFER
46,200
Die Size
15.4 x 15.4 MILS
Die Thickness
7.1 MILS
Anode 1 Bonding Pad Area
5.9 x 5.9 x 8.3 MILS
Anode 2 Bonding Pad Area
5.9 x 5.9 x 8.3 MILS
Top Side Metalization
Al - 30,000Å
Back Side Metalization
Au-As - 10,000Å
BACKSIDE COMMON CATHODE
R0
www.centr a lsemi.com
R2 (6-October 2011)


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