SI-3012LU datasheet(2/2 Pages) SANKEN

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ICs

SI-3000LU Series

■External Dimensions (SOT89-5)

Pin Assignment

q ADJ

w GND

e VC

r VIN

t VO

Plastic Mold Package Type

Flammability: UL94V-0

Product Mass: Approx. 0.05g

(Unit : mm)

4.5±0.05

0.1±0.05

0.4±0.03

1.6±0.05

4.2±0.05

4.7±0.05

1.5±0.05

( 1.0

±0.0

5 )

■Block Diagram

■Typical Connection Diagram

■Reference Data

CO: Output capacitor (10 µF or larger)

For SI-3000LU series, Co has to be a low ESR capacitor such as a

ceramic capacitor.

CIN: Input capacitor (10 µF approx.)

•Setting of SI-3012LU output voltage (recommended voltage: 1.5 V to 15 V)

R1 and R2: Resistors for output setting

The output voltage can be set by connecting R1 and R2 as shown in the

diagram on the left.

R2: 100 kΩ is recommended

R1=(VO–VADJ)/(VADJ/R2)

SI-3012LU

REF

TSD

–

VIN

GND

ADJ

Copper Laminate Area vs Power Dissipation

Tj=100°C PCB size 40×40

SI-3012LU

VIN

ADJ

CIN

GND

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

100

1000

Copper Laminate Area (mm2)

Ta=25°C

Ta=40°C

Ta=60°C

Ta=85°C

Case temperature Tc

measurement point

•A monolithic ICs mounts an inner frame stage that is connected to the GND

pin (pin 2). Therefore, enlarging the copper laminate area connected to the

GND pin improves heat radiation effect.

• Obtaining the junction temperature

Measure the temperature TC at the lead part of the GND pin (pin 2) with a

thermocouple, etc. Then, substitute this value in the following formula to

obtain the junction temperature.

Tj=PD×θj–c+Tc

(θj–c=5°C/W)

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