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ML610401 Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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ML610401 Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers |
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9 / 31 page ![]() FEDL610403-02 ML610401/ML610402/ML610403 9/31 ML610402 Chip Pin Layout & Dimension 31 SEG11 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 COM4/SEG2 COM3/SEG1 COM2/SEG0 COM1 COM0 C2 C1 48 P01 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 P02 P03 P30 P31 P34 P32 P33 P35 P53 P52 P51 P50 P40 P41 P42 1.75mm 1.82mm X Y Note: The assignment of the pads P30 to P35 are not in order. Chip size: 1.82 mm × 1.75 mm PAD count: 63 pins Minimum PAD pitch: 80 μm PAD aperture: 70 μm×70μm Chip thickness: 350 μm Voltage of the rear side of chip: VSS level. Figure 6 ML610402 Chip Layout & Dimension |
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