L6235N datasheet(27/35 Pages) STMICROELECTRONICS

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L6235

Application information

11.2

Thermal management

In most applications the power dissipation in the IC is the main factor that sets the maximum

current that can be delivered by the device in a safe operating condition. Selecting the

appropriate package and heatsinking configuration for the application is required to maintain

the IC within the allowed operating temperature range for the application. Figure 25, 26 and

27 show the junction to ambient thermal resistance values for the PowerSO36, PowerDIP24

and SO24 packages.

For instance, using a PowerSO package with a copper slug soldered on a 1.5 mm copper

thickness FR4 board with a 6 cm2 dissipating footprint (copper thickness of 35

m), the

Rth(j-amb) is about 35 °C/W. Figure 28 shows mounting methods for this package. Using

a multilayer board with vias to a ground plane, thermal impedance can be reduced down to

15 °C/W.

Figure 25. PowerSO36 junction ambient thermal resistance versus on-board copper

area

Figure 26. PowerDIP24 junction ambient thermal resistance versus on-board copper

area

L6235N Datasheet(PDF) 27 Page - STMicroelectronics