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OPA830 Datasheet(PDF) 2 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # OPA830
Description  Low-Power, Single-Supply, Wideband Operational Amplifier
PDF  37 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

OPA830 Datasheet(HTML) 2 Page - National Semiconductor (TI)

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OPA830
SBOS263F − AUGUST 2004 − REVISED AUGUST 2008
www.ti.com
2
ABSOLUTE MAXIMUM RATINGS(1)
Power Supply
12VDC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Internal Power Dissipation
See Thermal Analysis
. . . . . . . . . . . . . .
Differential Input Voltage
±2.5V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage Range (Single Supply)
−0.5V to +VS + 0.3V
. . . . . . .
Storage Temperature Range: D, DBV
−65
°C to +125°C
. . . . . . . . .
Lead Temperature (soldering, 10s)
+300
°C
. . . . . . . . . . . . . . . . . . . .
Junction Temperature (TJ)
+150
°C
. . . . . . . . . . . . . . . . . . . . . . . . . . .
ESD Rating:
Human Body Model (HBM)
2000V
. . . . . . . . . . . . . . . . . . . . . . .
Charge Device Model (CDM)
1500V
. . . . . . . . . . . . . . . . . . . . .
Machine Model (MM)
200V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
PACKAGE
DESIGNATOR
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER
TRANSPORT
MEDIA, QUANTITY
OPA830
SO-8 Surface-Mount
D
−40
°C to +85°C
OPA830
OPA830ID
Rails, 100
OPA830IDR
Tape and Reel, 2500
OPA830
SOT23-5
DBV
−40
°C to +85°C
A72
OPA830IDBVT
Tape and Reel, 250
OPA830IDBVR
Tape and Reel, 3000
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
PIN CONFIGURATIONS
1
2
3
5
4
Output
−V
S
Noninverting Input
+V
S
Inverting Input
A72
Pin Orientation/Package Marking
SOT23−5
1
2
3
4
8
7
6
5
NC
Inverting Input
Noninverting Input
−V
S
NC
+V
S
Output
NC
SO−8
NC = No Connection



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