LMV2011MF datasheet(17/24 Pages) NSC

17 / 24 page

PACKAGE OPTION ADDENDUM

www.ti.com

1-Nov-2013

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

LMV2011MA/NOPB

ACTIVE

SOIC

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

LMV20

11MA

LMV2011MAX

NRND

SOIC

2500

TBD

Call TI

0 to 70

LMV20

11MA

LMV2011MAX/NOPB

ACTIVE

SOIC

2500

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

LMV20

11MA

LMV2011MF

NRND

SOT-23

DBV

1000

TBD

Call TI

0 to 70

A84A

LMV2011MF/NOPB

ACTIVE

SOT-23

DBV

1000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

A84A

LMV2011MFX/NOPB

ACTIVE

SOT-23

DBV

3000

Green (RoHS

& no Sb/Br)

CU SN

Level-1-260C-UNLIM

0 to 70

A84A

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

LMV2011MF Datasheet(PDF) 17 Page - National Semiconductor (TI)

LMV2011MF Datasheet(HTML) 17 Page - National Semiconductor (TI)

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