CS8361 datasheet(5/6 Pages) CHERRY

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VIN

VSTBY

CS8361

Gnd

µF

ESR<8

Ω

VDD

I/O

MCU

Gnd

B+

C2**

C1*

VTRK

RESET

ENABLE

RESET

5V, 100mA

Adj

µF

ESR<8

Ω

C3**

SW 8V,

250mA

* C1 is required if regulator is located far from power supply filter.

** C2 and C3 are required for stability.

VTRK ~ VSTBY (1 + R1/R2)

For VTRK ~ 8V, R1/R2 ~ 0.6

0.1

µF

Test & Application Circuits

VIN

VSTBY

CS8361

Gnd

µF

ESR<8

Ω

VDD

I/O

MCU

Gnd

B+

C2**

C1*

VTRK

RESET

ENABLE

RESET

5V, 100mA

Adj

µF

ESR<8

Ω

C3**

SW 5V,

250mA

0.1

µF

* C1 is required if regulator is located far from power supply filter.

** C2 and C3 are required for stability.

A heat sink effectively increases the surface area of the

package to improve the flow of heat away from the IC and

into the surrounding air.

Each material in the heat flow path between the IC and the

outside environment will have a thermal resistance. Like

series electrical resistances, these resistances are summed

to determine the value of RQJA:

RQJA = RQJC + RQCS + RQSA

(3)

where:

RQJC = the junctionÐtoÐcase thermal resistance,

RQCS = the caseÐtoÐheat sink thermal resistance, and

RQSA = the heat sinkÐtoÐambient thermal resistance.

RQJC appears in the package section of the data sheet. Like

RQJA, it too is a function of package type. RQCS and RQSA

are functions of the package type, heat sink and the inter-

face between them. These values appear in heat sink data

sheets of heat sink manufacturers.

Heat Sinks

Application Notes: continued

Figure 2: 5V, 8V Regulator

Figure 3: Dual 5V Regulator

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