XMMA1000P XMMA2000W

8

Motorola Sensor Device Data

PACKAGE DIMENSIONS

CASE 648C–03

ISSUE C

DIP PACKAGE

–A–

–B–

16

9

18

F

D

G

E

N

K

C

NOTE 5

16 PL

S

A

M

0.13 (0.005)

T

–T–

SEATING

PLANE

S

B

M

0.13 (0.005)

T

M

L

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.740

0.840

18.80

21.34

B

0.240

0.260

6.10

6.60

C

0.145

0.185

3.69

4.69

D

0.015

0.021

0.38

0.53

E

0.050 BSC

1.27 BSC

F

0.040

0.70

1.02

1.78

G

0.100 BSC

2.54 BSC

J

0.008

0.015

0.20

0.38

K

0.115

0.135

2.92

3.43

L

0.300 BSC

7.62 BSC

M

0

10

0

10

N

0.015

0.040

0.39

1.01

_

_

_

_

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. INTERNAL LEAD CONNECTION BETWEEN 4 AND

5, 12 AND 13.

CASE 456–03

ISSUE D

WB PACKAGE

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

15.70

0.638

0.618

16.21

B

6.35

0.270

0.250

6.86

C

3.30

0.135

0.130

3.43

D

0.38

0.021

0.015

0.53

E

8.33

0.368

0.328

9.35

G

0.100 BSC

2.54 BSC

H

0.050 BSC

1.27 BSC

J

0.009

0.012

0.23

0.30

K

0.125

0.140

3.18

3.56

L

0.063

0.070

1.60

1.78

M

0.015

0.025

0.38

0.64

N

0.036

0.044

0.91

1.12

P

0.110

0.120

2.79

3.05

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

–A–

M

A

M

0.13 (0.005)

T

12

16

7

G

H

K

C

–B–

L

J

N

P

E

–T–

M

F

F

2.84

0.112

3.05

0.120

S

S

0.025

0.035

0.64

0.89

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XMMA1000P/D

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