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IXTH152N085T Datasheet(PDF) 2 Page - IXYS Corporation |
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IXTH152N085T Datasheet(HTML) 2 Page - IXYS Corporation |
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2 / 5 page ![]() IXYS reserves the right to change limits, test conditions, and dimensions. IXTH152N085T IXTQ152N085T Symbol Test Conditions Characteristic Values (T J = 25°C unless otherwise specified) Min. Typ. Max. g fs V DS= 10 V; ID = 60 A, Note 1 60 100 S C iss 5500 pF C oss V GS = 0 V, VDS = 25 V, f = 1 MHz 720 pF C rss 150 pF t d(on) Resistive Switching Times 30 n s t r V GS = 10 V, VDS = 0.5 VDSS, ID = 25 A 50 ns t d(off) R G = 5 Ω (External) 50 ns t f 45 n s Q g(on) 114 nC Q gs V GS= 10 V, VDS = 0.5 VDSS, ID = 25 A 30 nC Q gd 35 nC R thJC 0.42 °C/W R thCS 0.25 °C/W Source-Drain Diode Symbol Test Conditions Characteristic Values T J = 25°C unless otherwise specified) Min. Typ. Max. I S V GS = 0 V 152 A I SM Pulse width limited by T JM 410 A V SD I F = 25 A, VGS = 0 V, Note 1 1.0 V t rr I F = 25 A, -di/dt = 100 A/μs90 n s V R = 40 V, VGS = 0 V Notes: 1. Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %; 2. On through-hole packages, R DS(on) Kelvin test contact location must be 5 mm or less from the package body. TO-3P (IXTQ) Outline Pins: 1 - Gate 2 - Drain 3 - Source 4, TAB - Drain TO-247AD Outline Dim. Millimeter Inches Min. Max. Min. Max. A 4.7 5.3 .185 .209 A 1 2.2 2.54 .087 .102 A 2 2.2 2.6 .059 .098 b 1.0 1.4 .040 .055 b 1 1.65 2.13 .065 .084 b 2 2.87 3.12 .113 .123 C .4 .8 .016 .031 D 20.80 21.46 .819 .845 E 15.75 16.26 .610 .640 e 5.20 5.72 0.205 0.225 L 19.81 20.32 .780 .800 L1 4.50 .177 ∅P 3.55 3.65 .140 .144 Q 5.89 6.40 0.232 0.252 R 4.32 5.49 .170 .216 S 6.15 BSC 242 BSC Terminals: 1 - Gate 2 - Drain 3 - Source Tab - Drain 1 2 3 IXYS MOSFETs and IGBTs are covered by 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 one or moreof the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405B2 6,759,692 7,063,975 B2 4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6771478 B2 7,071,537 PRELIMINARYTECHNICALINFORMATION The product presented herein is under development. The Technical Specifications offered are derived from data gathered during objective characterizations of preliminary engineering lots; but also may yet contain some information supplied during a pre- production design evaluation. IXYS reserves the right to change limits, test conditions, and dimensions without notice. |
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