DS1230Y/AB

11 of 12

DS1230Y/AB NONVOLATILE SRAM, 34-PIN POWERCAP MODULE WITH

POWERCAP

INCHES

PKG

DIM

MIN

NOM

MAX

A

0.920

0.925

0.930

B

0.955

0.960

0.965

C

0.240

0.245

0.250

D

0.052

0.055

0.058

E

0.048

0.050

0.052

F

0.015

0.020

0.025

G

0.020

0.025

0.030

ASSEMBLY AND USE

Reflow soldering

Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder

reflow oriented label-side up (live-bug).

Hand soldering and touch-up

Do not touch soldering iron to leads for more than 3 seconds. To solder, apply flux to the pad, heat the

lead frame pad and apply solder. To remove part, apply flux, heat pad until solder reflows, and use a

solder wick.

LPM replacement in a socket

To replace a Low Profile Module in a 68-pin PLCC socket, attach a DS9034PC PowerCap to a module

base then insert the complete module into the socket one row of leads at a time, pushing only on the

corners of the cap. Never apply force to the center of the device. To remove from a socket, use a PLCC

extraction tool and ensure that it does not hit or damage any of the module IC components. Do not use

any other tool for extraction.