DS1557

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DS1557P

NOTE:

Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder

reflow oriented with the label side up (“live-bug”).

Hand Soldering and touch-up: Do not touch or apply the soldering iron to leads for more than 3 seconds.

To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part, apply

flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.

PKG

INCHES

DIM

MIN

NOM

MAX

A

0.920

0.925

0.930

B

0.980

0.985

0.990

C

-

-

0.080

D

0.052

0.055

0.058

E

0.048

0.050

0.052

F

0.015

0.020

0.025

G

0.025

0.027

0.030