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IMT4 Datasheet(PDF) 1 Page - Diodes Incorporated |
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IMT4 Datasheet(HTML) 1 Page - Diodes Incorporated |
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1 / 3 page ![]() DS30303 Rev. 2 - 2 1 of 3 IMT4 www.diodes.com · Epitaxial Planar Die Construction · Complementary NPN Type Available (IMX8) · Small Surface Mount Package Features Maximum Ratings @ TA = 25 °C unless otherwise specified A M J L D F B C H K B 2 B 1 E 1 C 2 E 2 C 1 Mechanical Data · Case: SOT-26, Molded Plastic · Case material - UL Flammability Rating Classification 94V-0 · Moisture sensitivity: Level 1 per J-STD-020A · Terminals: Solderable per MIL-STD-202, Method 208 · Terminal Connections: See Diagram · Marking: KX7, See Page 2 · Ordering & Date Code Information: See Page 2 · Weight: 0.016 grams (approx.) IMT4 DUAL PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR Characteristic Symbol IMT4 Unit Collector-Base Voltage VCBO -120 V Collector-Emitter Voltage VCEO -120 V Emitter-Base Voltage VEBO -5.0 V Collector Current - Continuous IC -50 mA Power Dissipation (Note 1) Pd 225 mW Thermal Resistance, Junction to Ambient (Note 1) RqJA 555 °C/W Operating and Storage Temperature Range Tj,TSTG -55 to +150 °C Electrical Characteristics @ TA = 25°C unless otherwise specified Characteristic Symbol Min Typ Max Unit Test Condition OFF CHARACTERISTICS (Note 2) Collector-Base Breakdown Voltage V(BR)CBO -120 ¾¾ V IC = -50 mA Collector-Emitter Breakdown Voltage V(BR)CEO -120 ¾¾ V IC = -1.0mA Emitter-Base Breakdown Voltage V(BR)EBO -5.0 ¾¾ V IE = -50 mA Collector Cutoff Current ICBO ¾¾ -0.5 mA VCB = -100V Emitter Cutoff Current IEBO ¾¾ -0.5 mA VEB = -4.0V ON CHARACTERISTICS (Note 2) DC Current Gain hFE 180 ¾ 820 ¾ IC = -2.0mA, VCE = -6.0V Collector-Emitter Saturation Voltage VCE(SAT) ¾¾ -0.5 V IC = -10mA, IB = -1.0mA SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product fT ¾ 140 ¾ MHz VCE = -12V, IE = 2.0mA, f = 100MHz SOT-26 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D ¾¾ 0.95 F ¾¾ 0.55 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 a 0 ° 8° ¾ All Dimensions in mm B 2 B 1 E 1 C 2 E 2 C 1 Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf. 200mW per element must not be exceeded. 2. Short duration pulse test used to minimize self-heating effect. |
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