CP343V datasheet(1/2 Pages) CENTRAL

Part #	CP343V

Description	N-Channel Enhancement-Mode MOSFET Chip

PDF	2 Pages

Scroll/Zoom	100%

Manufacturer	CENTRAL [Central Semiconductor Corp]

Direct Link	http://www.centralsemi.com

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1 / 2 page

GEOMETRY

PRINCIPAL DEVICE TYPE

CXDM1002N

GROSS DIE PER 6 INCH WAFER

7,774

PROCESS CP343V

High Voltage MOSFET

N-Channel Enhancement-Mode MOSFET Chip

PROCESS DETAILS

Die Size

55 x 55 MILS

Die Thickness

7.1 MILS

Gate Bonding Pad Area

7.3 x 7.3 MILS

Source Bonding Pad Area

43 x 43 MILS

Top Side Metalization

Al - 30,000Å

Back Side Metalization

Ti/Ni/Ag - 1,000Å/3,000Å/10,000Å

www.centr a lsemi.com

R0 (19-March 2013)

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