GP800NSS33

8/9

Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.

www.dynexsemi.com

POWER ASSEMBLY CAPABILITY

The Power Assembly group provides support for those customers requiring more than the basic semiconductor switch. Using CAD

design tools the group has developed a flexible range of heatsink / clamping systems in line with advances in device types and the

voltage and current capability of Dynex semiconductors.

An extensive range of air and liquid cooled assemblies is available covering the range of circuit designs in general use today.

HEATSINKS

The Power Assembly group has a proprietary range of extruded aluminium heatsinks. These were designed to optimise the

performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on

request.

For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer

service office.

ASSOCIATED PUBLICATIONS

Title

Application Note

Number

Electrostatic handling precautions

AN4502

An introduction to IGBTs

AN4503

IGBT ratings and characteristics

AN4504

Heatsink requirements for IGBT modules

AN4505

Calculating the junction temperature of power semiconductors

AN4506

Gate drive considerations to maximise IGBT efficiency

AN4507

Parallel operation of IGBTs – punch through vs non-punch through characteristics

AN4508

Guidance notes for formulating technical enquiries

AN4869

Principle of rating parallel connected IGBT modules

AN5000

Short circuit withstand capability in IGBTs

AN5167

Driving high power IGBTs with Concept gate drivers

AN5190