REV.

ADG3245

–3–

ABSOLUTE MAXIMUM RATINGS

*

°C, unless otherwise noted.)

Digital Inputs to GND . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Input Voltage . . . . . . . . . . . . . . . . . . . . . –0.5 V to +4.6 V

DC Output Current . . . . . . . . . . . . . . . . . . 25 mA per channel

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . . . –40

°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +150°C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150

°C

LFCSP Package

°C/W

TSSOP Package

°C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300

°C

IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

Table II. Truth Table

BE SEL*

Function

L

L

A = B, 3.3 V to 1.8 V Level Shifting

LH

A = B, 3.3 V to 2.5 V/2.5 V to 1.8 V Level Shifting

H

X

Disconnect

*

SEL = 0 V only when V

± 10%

PIN CONFIGURATION

20-Lead LFCSP and TSSOP

TOP VIEW

(Not to Scale)

20

19

18

17

16

15

14

13

12

11

1

2

3

4

5

6

7

8

9

10

ADG3245

GND

A7

A6

A0

A1

A2

A5

A4

A3

B7

B6

B5

BE

B0

B1

B4

B3

B2

SEL

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADG3245 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

REV. A

–11–

EP

Exposed Pad. It is

recommended that

the exposed pad be

thermally connected

to a copper plane for

enhanced thermal

performance. The pad

should be grounded as

well.

Table I. Pin Description

Mnemonic Description

BE

Bus Enable (Active Low)

SEL

Level Translation Select

Ax

Port A, Inputs or Outputs

Bx

Port B, Inputs or Outputs

EP

Exposed Pad. It is recommended

that the exposed pad be thermally

connected to a copper plane for

enhanced thermal performance.

The pad should be grounded as

well.

B

NOTES

1. IT IS RECOMMENDED THAT THE EXPOSED PAD BE

THERMALLY CONNECTED TO A COPPER PLANE

FOR ENHANCED THERMAL PERFORMANCE. THE

PAD SHOULD BE GROUNDED AS WELL.

14

13

12

1

3

4

B0

15 BE

B1

B2

11 B3

SEL

A5

2

A4

A6

5

A7

ADG3245

TOP VIEW

(Not to Scale)