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IXFR15N100Q3 Datasheet(PDF) 2 Page - IXYS Corporation

Part # IXFR15N100Q3
Description  Advance Technical Information
PDF  5 Pages
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Manufacturer  IXYS [IXYS Corporation]
Direct Link  http://www.ixys.com
Logo IXYS - IXYS Corporation

IXFR15N100Q3 Datasheet(HTML) 2 Page - IXYS Corporation

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IXFR15N100Q3
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
4,835,592
4,931,844
5,049,961
5,237,481
6,162,665
6,404,065 B1
6,683,344
6,727,585
7,005,734 B2
7,157,338B2
by one or more of the following U.S. patents: 4,850,072
5,017,508
5,063,307
5,381,025
6,259,123 B1
6,534,343
6,710,405 B2 6,759,692
7,063,975 B2
4,881,106
5,034,796
5,187,117
5,486,715
6,306,728 B1
6,583,505
6,710,463
6,771,478 B2 7,071,537
1 = Gate
2,4 = Drain
3 = Source
ISOPLUS247 (IXFR) Outline
Note
1. Pulse test, t
≤ 300μs, duty cycle, d ≤ 2%.
Symbol
Test Conditions
Characteristic Values
(T
J = 25°C Unless Otherwise Specified)
Min.
Typ.
Max.
g
fs
V
DS = 20V, ID = 7.5A, Note 1
7.5
12.5
S
C
iss
3250
pF
C
oss
V
GS
= 0V, V
DS = 25V, f = 1MHz
265
pF
C
rss
24
pF
R
Gi
Gate Input Resistance
0.20
Ω
t
d(on)
28
ns
t
r
10
ns
t
d(off)
30
ns
t
f
8
ns
Q
g(on)
64
nC
Q
gs
V
GS = 10V, VDS = 0.5 • VDSS, ID = 7.5A
23
nC
Q
gd
27
nC
R
thJC
0.31
°C/W
R
thCS
0.15
°C/W
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
(T
J = 25°C Unless Otherwise Specified)
Min.
Typ.
Max.
I
S
V
GS = 0V
15
A
I
SM
Repetitive, Pulse Width Limited by T
JM
60
A
V
SD
I
F = IS, VGS = 0V, Note 1
1.4
V
t
rr
250
ns
I
RM
7.6
A
Q
RM
660
nC
I
F = 7.5A, -di/dt = 100A/μs
V
R = 100V, VGS = 0V
Resistive Switching Times
V
GS = 10V, VDS = 0.5 • VDSS, ID = 7.5A
R
G = 2Ω (External)
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.



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