Chip Silicon Rectifier

FFM101 THRU FFM107

Fast recovery type

Features

Plastic package has Underwriters Laboratory

FlammabilityClassification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDEC DO-214AC

Terminals : Solder plated, s olderable per MIL-STD-750,

Method 2026

Polarity : Indicated by cathode band

Mounting Position : Any

Weight : 0.0015 ounce, 0.05 gr am

(V)

(V)

(V)

(V)

(nS)

(

FFM101

F11

50

35

50

FFM102

F12

100

70

100

FFM103

F13

200

140

200

FFM104

F14

400

280

400

FFM105

F15

600

420

600

250

FFM106

F16

800

560

800

FFM107

F17

1000

700

1000

-55 to +150

Operating

temperature

*1

*2

*3

*4

*5

500

150

SYMBOLS

MARKING

CODE

1.3

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

Ambient temperature = 55

1.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

30

A

25

5.0

uA

100

uA

Thermal resistance

Junction to ambient

R

32

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

15

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

*5 Reverse recovery time

0.185(4.8)

0.177(4.4)

0.012(0.3) Typ.

0.110(2.8)

0.094(2.4)

0.165(4.2)

0.150(3.8)

0.067(1.7)

0.060(1.5)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMA

Formosa MS