Chip Silicon Rectifier

FFM301 THRU FFM307

Fast recovery type

Features

Plastic package has Underwriters Laboratory

Flammability Classification 94V-O Utilizing Flame

Retardant Epoxy Molding Compound.

For surface mounted applications.

Exceeds environmental standards of MIL-S-19500 /

228

Low leakage current.

Mechanical data

Case : Molded plastic, JEDECDO-214AB

Terminals : Solder plated, solderable per MIL-STD-750,

Method 2026

Polarity : Indicated by c athode band

Mounting Position : Any

Weight : 0.00585 ounce, 0.195 gram

(V)

(V)

(V)

(V)

(nS)

(

FFM301

F31

50

35

50

FFM302

F32

100

70

100

FFM303

F33

200

140

200

FFM304

F34

400

280

400

FFM305

F35

600

420

600

250

FFM306

F36

800

560

800

FFM307

F37

1000

700

1000

SYMBOLS

MARKING

CODE

1.3

-55 to +150

Operating

temperature

*1

*2

*3

*4

*5

500

150

PARAMETER

CONDITIONS

Symbol

MIN.

TYP.

MAX.

UNIT

Forward rectified current

Ambient temperature = 55

3.0

A

Forward surge current

8.3ms single half sine-wave superimposed on

rate load (JEDEC methode)

100

A

25

10.0

uA

300

uA

Thermal resistance

Junction to ambient

R

50

Diode junction capacitance

f=1MHz and applied 4vDC reverse voltage

60

pF

Storage temperature

-55

+150

Reverse current

*1 Repetitive peak reverse voltage

*2 RMS voltage

*3 Continuous reverse voltage

*4 Maximum forward voltage

*5 Reverse recovery time

Formosa MS

0.276(7.0)

0.260(6.6)

0.012(0.3) Typ.

0.189(4.8)

0.173(4.4)

0.244(6.2)

0.228(5.8)

0.087(2.2)

0.071(1.8)

0.040 (1.0) Typ.

0.040(1.0) Typ.

Dimensions in inches and (millimeters)

SMC

0.152(3.8)

0.144(3.6)

0.032(0.8) Typ.