Appendix

- 134 -

Recommended Solder Reflow Profile

NVE recommends the following soldering profile

:

300

For leaded (Pb) parts, the peak temperature shown in this profile can be decreased to as low as 230°C.

Exceeding 265°C at peak or the time at peak temperature shown in this profile can damage the parts.

Specifically:

1.

AA- and AD-Series sensors are rated at 150°C maximum storage temperature. They can withstand

the solder profile shown above with no harmful effects. However, temperatures above 265°C for

even a brief period or extended periods above 160°C can cause degradation of the GMR sensor

element.

2.

AKL- and DD-Series parts contain an on-chip EEPROM. Exposure to temperatures in excess of

265°C can cause EEPROM data corruption, which will cause the parts to fall out of specification.