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NTP4302 Datasheet(PDF) 1 Page - ON Semiconductor

Part # NTP4302
Description  Power MOSFET 74 Amps, 30 Volts N?묬hannel TO??20 & D2PAK
PDF  7 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTP4302 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2005
August, 2005 − Rev. 3
1
Publication Order Number:
NTP4302/D
NTP4302, NTB4302
Power MOSFET
74 Amps, 30 Volts
N−Channel TO−220 & D2PAK
Features
• Low RDS(on)
• Higher Efficiency Extending Battery Life
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• IDSS Specified at Elevated Temperature
• Pb−Free Packages are Available
Typical Applications
• DC−DC Converters
• Low Voltage Motor Control
• Power Management in Portable and Battery Powered Products:
Ie: Computers, Printers, Cellular and Cordless Telephones, and
PCMCIA Cards
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
VDSS
30
Vdc
Drain−to−Gate Voltage (RGS = 10 MW)
VDGR
30
Vdc
Gate−to−Source Voltage − Continuous
VGS
"20
Vdc
Drain Current
− Continuous @ TC = 25°C
− Continuous @ TC = 100°C
− Single Pulse (tpv10 ms)
ID
ID
IDM
74
47
175
Adc
Apk
Total Power Dissipation @ TC = 25°C
Derate above 25
°C
PD
80
0.66
W
W/
°C
Operating and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 10 Vdc, L = 5.0 mH
IL(pk) = 17 A, VDS = 30 Vdc, RG = 25 W)
EAS
722
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
RqJC
RqJA
1.55
70
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 Board using minimum recommended Pad
Size, (Cu Area 0.412 in2).
2. Current limited by internal lead wires.
TO−220AB
CASE 221A
STYLE 5
1
2
3
4
N−Channel
D
S
G
MARKING DIAGRAMS
& PIN ASSIGNMENTS
1
2
3
4
D2PAK
CASE 418AA
STYLE 2
http://onsemi.com
VDSS
RDS(ON) MAX
ID MAX
30 V
9.3 m
W @ 10 V
74 A
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
NTx4302
= Device Code
x
= B or P
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
NTx4302G
AYWW
1
Gate
3
Source
4
Drain
2
Drain
NTx4302G
AYWW
1
Gate
3
Source
4
Drain
2
Drain


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