Features

Applications

Surface Mount Devices

Almost anywhere there is a low voltage

Lead free deivce

power supply, up to DC60V and a load

Size 5045mm/2018 mils

to be protested, including:

Surface Mount packaging for automated assembly

Computer mother board, Modem.

Agency recognition:

Telecommunication equipments

Model

D

min

max

min

max

min

max

min

TSM030

4.44

4.72

4.22

4.93

0.60

1.10

0.30

TSM050

4.44

4.72

4.22

4.93

0.60

1.10

0.30

TSM100

4.44

4.72

4.22

4.93

0.45

0.80

0.30

Product dimensions (mm)

Dimensions (mm)

A

B

C

TSM100

4.

4.

4.22

4.93

0.45

0.80

0.30

TSM100/33

4.44

4.72

4.22

4.93

0.45

0.80

0.30

TSM150

4.44

4.72

4.22

4.93

0.45

0.80

0.30

TSM200

4.44

4.72

4.22

4.93

0.45

0.80

0.30

Test

Passive aging

Humidity aging

Thermal shock

Resistance to solvent

Vibration

Maximum surface of the device in the tripped state is 125℃

MIL-STD-202,Method 215

No change

Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Terminal pad materials

Terminal pad solderability

Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper

Termination pad characteristics

Ambient operating confitions:-40℃ to 85℃

MIL-STD-202,Method 201

No change

Environmental Specifications

±5% typical

85℃,85%℃R.H.,168hrs

±5% typical

85℃,to-40℃,13times

±33% typical

Conditions

Resistance change

85℃,1000hrs

3.4 ±0.1

1.5 ±0.1

1.5 ±0.1

Z Z Z

B

D

A

C

PPTC/TSM Series

01 | www.spsemi.cn

REV.2014.05.01