PowerPAD

(17)

16

SS

EN

VIN

SW

FREQ

NC

PGND

PGND

15

14

13

5

6

7

8

1

2

3

4

12

11

10

9

1

7

6

5

4

3

2

14

8

9

10

11

12

13

SW

SW

VIN

EN

SS

SYNC

AGND

PGND

PGND

NC

FREQ

FB

COMP

PGND

PowerPAD

(15)

TPS55340

SLVSBD4B – MAY 2012 – REVISED OCTOBER 2012

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PART NUMBER

PACKAGE

TPS55340RTE

QFN-16

-40°C to 150°C

TPS55340PWP

HTSSOP-14

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

PIN ASSIGNMENTS

QFN-16 PACKAGE

HTSSOP-14 PACKAGE

(Top View)

(Top View)

PIN FUNCTIONS

PIN

DESCRIPTION

NO.

NAME

QFN-16

HTSSOP-14

VIN

2

3

The input supply pin to the IC. Connect VIN to a supply voltage between 2.9V and 32V. It is acceptable for the

voltage on the pin to be different from the boost power stage input.

SW

1, 15, 16

1, 2

SW is the drain of the internal power MOSFET. Connect SW to the switched side of the boost or SEPIC inductor or

the flyback transformer.

FB

8

9

Error amplifier input and feedback pin for positive voltage regulation. Connect to the center tap of a resistor divider

to program the output voltage.

EN

3

4

Enable pin. When the voltage of this pin falls below the enable threshold for more than 1ms, the IC turns off.

COMP

7

8

Output of the transconductance error amplifier. An external RC network connected to this pin compensates the

regulator feedback loop.

SS

4

5

Soft-start programming pin. A capacitor between the SS pin and AGND pin programs soft-start timing.

FREQ

9

10

Switching frequency program pin. An external resistor connected between the FREQ pin and AGND sets the

switching frequency.

AGND

6

7

Signal ground of the IC.

PGND

11, 12, 13

12, 13, 14

Power ground of the IC. It is connected to the source of the internal power MOSFET switch.

SYNC

5

6

Switching frequency synchronization pin. An external clock signal can be used to set the switching frequency

between 200kHz and 1.0MHz. If not used, this pin should be tied to AGND.

NC

10, 14

11

Reserved pin that must be connected to ground.

PowerPAD

17

15

The PowerPAD should be soldered to the AGND. If possible, use thermal vias to connect to internal ground plane

for improved power dissipation.

2

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