LP5990 datasheet(3/18 Pages) TI1

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LP5990

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SNVS438B – APRIL 2007 – REVISED DECEMBER 2007

Absolute Maximum Ratings

(1) (2)

VIN Pin: Input Voltage

-0.3 to 6.0V

VOUT Pin: Output Voltage

-0.3 to (VIN + 0.3V) to 6.0V (max)

VEN Pin: Enable Input Voltage

-0.3 to 6.0V (max)

Continuous Power Dissipation (3)

Internally Limited

Junction Temperature (TJMAX)

150°C

Storage Temperature Range

-65 to 150°C

Maximum Lead Temperature (Soldering, 10 sec.)

260°C

ESD Rating (4)

Human Body Model

2 kV

Machine Model

200V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

Internal thermal shutdown circuitry protects the device from permanent damage.

(4)

The Human body model is a 100 pF capacitor discharged through a 1.5 k

Ω resistor into each pin. The machine model is a 200 pF

capacitor discharged directly into each pin. MIL-STD-883 3015.7

Operating Ratings

(1), (2)

VIN: Input Voltage Range

2.2V to 5.5V

VEN: Enable Voltage Range

0 to 5.5V (max)

Recommended Load Current

0 to 200 mA

(3)

Junction Temperature Range (TJ)

-40°C to +125°C

Ambient Temperature Range (TA)

-40°C to +85°C

(3)

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under

which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed

performance limits and associated test conditions, see the Electrical Characteristics tables.

(2)

All voltages are with respect to the potential at the GND pin.

(3)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =

125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX). See applications section.

Thermal Properties

Junction to Ambient Thermal Resistance

θJA

(1)

JEDEC Board (microSMD)

(2)

100.6°C/W

4L Cellphone Board (microSMD)

174.8°C/W

(1)

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power

dissipation exists, special care must be paid to thermal dissipation issues in board design.

(2)

Detailed description of the board can be found in JESD51-7

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