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DG2 Datasheet(PDF) 1 Page - General Semiconductor |
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DG2 Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page  CG2 AND DG2 MINIATURE CLAMPER / DAMPER GLASS PASSIVATED RECTIFIER Reverse Voltage - 1400 to 1500 Volts Forward Current - 2.0 Amperes FEATURES ♦ Specially designed for clamping circuits in horizontal deflection systems and damper applications ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ 2.0 Ampere operation at TA=50°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ Hermetically sealed package ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS CG2 DG2 UNITS Maximum repetitive peak reverse voltage VRRM 1400 1500 Volts Maximum RMS voltage VRMS 980 1050 Volts Maximum DC blocking voltage VDC 1400 1500 Volts Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=50°C I(AV) 2.0 Amps Peak forward surge current 8.3ms single half sine -wave superimposed on rated load (JEDEC Method) IFSM 40.0 Amps Maximum instantaneous forward voltage at 2.0A VF 1.1 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=100°C IR 100.0 µA Maximum full load reverse current full cycle average 0.375” (9.5mm) lead length at TA=100°C IR(AV) 200.0 µA Maximum reverse recovery time (NOTE 1) trr 15.0 20.0 µs Typical junction capacitance (NOTE 2) CJ 15.0 pF Typical thermal resistance (NOTE 3)R ΘJA 55.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Measured with IF=0.5A, IR=50mA (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375” (9.5mm) lead length, P.C.B. mounted 4/98 0.034 (0.86) 0.028 (0.71) DIA. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 1.0 (25.4) MIN. DO-204AP Dimensions in inches and (millimeters) *Braised-lead assembly is covered by Patent No. 3,930,306 |
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