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EDF1AM Datasheet(PDF) 1 Page - General Semiconductor

Part # EDF1AM
Description  MINIATURE GLASS PASSIVATED FAST EFFICIENT BRIDGE RECTIFIER
PDF  2 Pages
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Manufacturer  GE [General Semiconductor]
Direct Link  http://www.vishay.com
Logo GE - General Semiconductor

EDF1AM Datasheet(HTML) 1 Page - General Semiconductor

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EDF1AM THRU EDF1DM
MINIATURE GLASS PASSIVATED FAST EFFICIENT BRIDGE RECTIFIER
Reverse Voltage - 50 to 200 Volts
Forward Current - 1.0 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
♦ This series is UL listed under Recognized Component Index,
file number E54214
♦ Glass passivated chip junctions
♦ High forward surge current capability
♦ Ideal for printed circuit boards
♦ Superfast recovery times for high efficiency
♦ High temperature soldering guaranteed:
260°C/10 seconds at 5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Polarity: Polarity symbols marked on body
Mounting Position: Any
Weight: 0.04 ounce, 1.0 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
EDF1AM
EDF1BM
EDF1CM
EDF1DM
UNITS
Maximum repetitive peak reverse voltage
VRRM
50
100
150
200
Volts
Maximum RMS voltage
VRMS
35
70
106
140
Volts
Maximum DC blocking voltage
VDC
50
100
150
200
Volts
Maximum average forward output
rectified current at TA=40°C
I(AV)
1.0
Amp
Peak forward surge current single half sine-wave super-
imposed on rated load (JEDEC Method) TJ=150°C
IFSM
50.0
Amps
Rating for fusing (t < 8.3ms)
I2t
10.0
A2sec
Maximum instantaneous forward voltage drop
per leg at 1.0A
VF
1.05
Volts
Maximum reverse current
TA=25°C
5.0
µA
at rated DC blocking voltage
TA=125°C
IR
1.0
mA
Maximum reverse recovery time at (NOTE 1)
trr
50.0
ns
Typical thermal resistance per leg (NOTE 2)
R
ΘJA
38.0
R
ΘJL
12.0
°C/W
Operating junction and storage temperature range
TJ, TSTG
-55 to +150
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Thermal resistance from junction to ambient and from junction to lead mounted on P.C.B. with 0.51 x 0.51" (13 x 13mm) copper pads
0.315 (8.00)
0.285 (7.24)
0.013 (3.3)
0.0086 (0.22)
0.350 (8.9)
0.300 (7.6)
0.255 (6.5)
0.245 (6.2)
0.335 (8.51)
0.320 (8.12)
0.045 (1.14)
0.035 (0.89)
0.080 (2.03)
0.050 (1.27)
0.023 (0.58)
0.018 (0.46)
0.185 (4.69)
0.150 (3.81)
0.130 (3.3)
0.120 (3.05)
0.075 (1.90)
0.055 (1.39)
0.205 (5.2)
0.195 (5.0)
Case Style DFM
Dimensions in inches and (millimeters)
7/28/98


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