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EGP50D Datasheet(PDF) 1 Page - General Semiconductor |
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EGP50D Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() EGP50A THRU EGP50G GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 400 Volts Forward Current - 5.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Low leakage current ♦ High surge current capability ♦ High temperature metallurgically bonded construction ♦ High temperature soldering guaranteed: 300°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Molded plastic over solid glass body Terminals: Axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.03 ounce, 0.8 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. EGP EGP EGP EGP EGP EGP SYMBOLS 50A 50B 50C 50D 50F 50G UNITS Maximum recurrent peak reverse voltage VRRM 50 100 150 200 300 400 Volts Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=55°C I(AV) 5.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load IFSM 150.0 Amps Maximum instantaneous forward voltage at 5.0A VF 0.95 1.25 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 50.0 ns Typical thermal resistance (NOTE 2) R ΘJA 20.0 R ΘJL 5.0 °C\W Typical junction capacitance (NOTE 3) CJ 95 75 pF Operating junction and storage temperature range TJ, TSTG -65 to +150 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Thermal resistance from junction to ambient and from junction of lead at 0.375” (9.5mm) lead length, both leads measured attached to heat sinks (3) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts 4/98 Case Style GP20 Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 ® 0.210 (5.3) 0.190 (4.8) DIA. 0.042 (1.07) 0.037 (0.94) DIA. 1.0 (25.4) MIN. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) MIN. |
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