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FE2A Datasheet(PDF) 1 Page - General Semiconductor |
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FE2A Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() 4/98 FE2A THRU FE2D GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 200 Volts Forward Current - 2.0 Amperes FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Hermetically sealed package ♦ Low leakage ♦ High surge capability ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.002 ounce, 0.56 gram MAXIMUM RATINGS AND MECHANICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS FE2A FE2B FE2C FE2D UNITS Maximum repetitive peak reverse voltage VRRM 50 100 150 200 Volts Maximum RMS voltage VRMS 35 70 105 140 Volts Maximum DC blocking voltage VDC 50 100 150 200 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TL=75°C I(AV) 2.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed IFSM 50.0 Amps on rated load (JEDEC Method) Maximum instantaneous forward voltage at 2.0A VF 0.95 Volts Maximum DC reverse current TA=25°C 2.0 at rated DC blocking voltage TA=100°C IR 50.0 µA Maximum reverse recovery time (NOTE 1) trr 35.0 ns Typical junction capacitance (NOTE 2) CJ 45.0 pF Typical thermal resistance (NOTE 3, 4) R ΘJA 60.0 °C/W R ΘJL 20.0 Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 VDC (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5” (12 x 12mm) copper pads (4) Thermal resistance from junction to lead at 0.375” (9.5mm) lead length with both leads attached to heatsinks 0.034 (0.86) 0.028 (0.71) DIA. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 1.0 (25.4) MIN. DO-204AP Dimensions in inches and (millimeters) *Brazed-lead assembly is covered by Patent No. 3,930,306 PA TENTED* |
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