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G3D Datasheet(PDF) 1 Page - General Semiconductor |
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G3D Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page  G3A THRU G3M GLASS PASSIVATED JUNCTION RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Amperes FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Hermetically sealed package ♦ 3.0 Ampere operation at TA=70°C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: Solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 ounce, 1.1 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS G3A G3B G3D G3G G3J G3K G3M UNITS Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=70°C I(AV) 3.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 125.0 Amps Maximum instantaneous forward voltage at 3.0A VF 1.2 1.1 Volts Maximum full load reverse current, full cycle average, 0.375” (9.5mm) lead length at TA=70°C IR(AV) 200.0 µA Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=150°C IR 100.0 µA Typical reverse recovery time (NOTE 1) trr 3.0 µs Typical junction capacitance (NOTE 2)CJ 40.0 pF Typical thermal resistance (NOTE 3)R ΘJA 20.0 °C/W R ΘJL 10.0 Operating junction and storage temperature range TJ, TSTG -65 to +175 °C NOTES: (1) Measured with IF=0.5A, IR=1A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length, with both leads mounted between heatsinks 4/98 0.250 (6.3) 0.170 (4.3) 0.052 (1.32) 0.048 (1.22) DIA. DIA. 1.0 (25.4) MIN MAX. 0.300 (7.6) 1.0 (25.4) MIN Case Style G3 Dimensions in inches and (millimeters) *Brazed-lead assembly is covered by Patent No. 3,930,306 |
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Similar Description - G3D |
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