ADS7881

SLAS400B − SEPTEMBER 2003 − REVISED NOVEMBER 2005

www.ti.com

2

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to

damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION

MODEL

MAXIMUM

INTEGRAL

LINEARITY

(LSB)

MAXIMUM

DIFFERENTIAL

LINEARITY

(LSB)

NO MISSING

CODES AT

RESOLUTION

(BIT)

PACKAGE

TYPE

PACKAGE

DESIGNATOR

TEMPERATURE

RANGE

ORDERING

INFORMATION

TRANSPORT

MEDIA QUANTITY

±1

±1

12

48-Pin

PFB

−40

°C to 85°C

ADS7881IPFBT

Tape and reel

250

ADS7881

±1

±1

12

48-Pin

TQFP

PFB

−40

°C to 85°C

ADS7881IPFBR

Tape and reel

1000

ADS7881

±1

±1

12

48-Pin

RGZ

−40

°C to 85°C

ADS7881IRGZT

Tape and reel

250

±1

±1

12

48-Pin

QFN

RGZ

−40

°C to 85°C

ADS7881IRGZR

Tape and reel

2500

NOTE: For most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range(1)

UNIT

+IN to AGND

−0.3 V to +VA + 0.1 V

−IN to AGND

−0.3 V to 0.5 V

+VA to AGND

−0.3 V to 7 V

+VBD to BDGND

−0.3 V to 7 V

Digital input voltage to GND

−0.3 V to (+VBD + 0.3 V)

Digital output to GND

−0.3 V to (+VBD + 0.3 V)

Operating temperature range

−40

°C to 85°C

Storage temperature range

−65

°C to 150°C

Junction temperature (TJmax)

150

°C

TQFP and QFN packages

Power dissipation

(TJ Max–TA)/ θJA

TQFP and QFN packages

θJA Thermal impedance

86

°C/W

Lead temperature, soldering

Vapor phase (60 sec)

215

°C

Lead temperature, soldering

Infrared (15 sec)

220

°C

(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.