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G1M Datasheet(PDF) 1 Page - General Semiconductor |
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G1M Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() G1A THRU G1M GLASS PASSIVATED JUNCTION RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere FEATURES ♦ High temperature metallurgically bonded constructed rectifiers ♦ Glass passivated cavity-free junction in D0-204AP package ♦ Hermetically sealed package ♦ 1.0 ampere operation at TA=100 °C with no thermal runaway ♦ Typical IR less than 0.1µA ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Solder plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS G1A G1B G1D G1G G1J G1K G1M UNITS Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 70 200 400 600 800 1000 Volts Maximum average forward rectified current 0.375” (9.5mm) lead length at TA=100°C I(AV) 1.0 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 50.0 Amps Maximum instantaneous forward voltage at 1.0A VF 1.2 1.1 Volts Maximum full load reverse current, full cycle average 0.375” (9.5mm) lead length at TA=100°C IR(AV) 200.0 µA Maximum DC reverse current TA=25°C 2.0 at rated DC blocking voltage TA=150°C IR 100.0 µA Typical reverse recovery time (NOTE 1) trr 1.5 µs Typical junction capacitance (NOTE 2) CJ 15.0 pF Typical thermal resistance (NOTE 3) R ΘJL 55.0 °C/W Operating junction and storage temperature range TJ, TSTG 65 to +175 °C NOTES: (1) Measured with IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length P.C.B. mounted 4/98 Dimensions in inches and (millimeters) *Brazed-lead assembly is covered by Patent No. 3,930,306 0.034 (0.86) 0.028 (0.71) DIA. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 1.0 (25.4) MIN. DO-204AP |
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