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GI1102 Datasheet(PDF) 1 Page - General Semiconductor |
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GI1102 Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page ![]() GI1101 THRU GI1104 GLASS PASSIVATED FAST EFFICIENT RECTIFIER Reverse Voltage - 50 to 200 Volts Forward Current - 2.5 Amperes FEATURES ♦ High temperature metallurgically bonded construction ♦ Glass passivated cavity-free junction ♦ Superfast recovery time for high efficiency ♦ Low forward voltage, high current capability ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ Hermetically sealed package ♦ Low Leakage ♦ High surge capability ♦ High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-204AP solid glass body Terminals: Plated axial leads, solderable per MIL-STD 750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.02 ounce, 0.56 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS GI1101 GI1102 GI1103 GI1104 UNITS Maximum repetitive peak reverse voltage VRRM 50 100 150 200 Volts Maximum RMS voltage VRMS 35 70 105 140 Volts Maximum DC blocking voltage VDC 50 100 150 200 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length (SEE FIG.1) I(AV) 2.5 2.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed IFSM 50.0 Amps on rated load (JEDEC Method) at rated TL Maximum instantaneous forward voltage at 2.0A VF 0.975 1.25 Volts (NOTE 5) Maximum DC reverse current TA=25°C 2.0 10.0 at rated DC blocking voltage TA=100°C IR 50.0 200.0 µA Maximum reverse recovery time (NOTE 1) trr 25.0 50.0 ns Typical junction capacitance (NOTE 2) CJ 45.0 pF Typical thermal resistance (NOTE 1) R ΘJA 65.0 (NOTE 4) R ΘJL 20.0 °C/W Operating junction and storage temperature range TJ, TSTG -65 to +175 -65 to +150 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHZ and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length and mounted on P.C.B. with 0.5 x 0.5” (12 x 12mm) copper pads (4) Thermal resistance from junction to lead at 0.375" (9.5mm) lead length with both leads attached to heat sinks (5) Tested at IF=1.0A 4/98 0.034 (0.86) 0.028 (0.71) DIA. 0.150 (3.8) 0.100 (2.5) DIA. 1.0 (25.4) MIN. 0.240 (6.1) MAX. 1.0 (25.4) MIN. DO-204AP Dimensions in inches and (millimeters) *Brazed lead assembly is covered by Patent No. 3,930,306 |
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