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RGP30 Datasheet(PDF) 1 Page - General Semiconductor |
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RGP30 Datasheet(HTML) 1 Page - General Semiconductor |
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1 / 2 page  RGP30A THRU RGP30M GLASS PASSIVATED JUNCTION FAST SWITCHING RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 3.0 Amperes FEATURES ♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ Glass passivated cavity-free junction ♦ Capable of meeting environmental standards of MIL-S-19500 ♦ High temperature metallurgically bonded construction ♦ 3.0 Ampere operation at TA=55°C with no thermal runaway ♦ Typical IR less than 0.2µA ♦ Fast switching for high efficiency ♦ High temperature soldering guaranteed 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension MECHANICAL DATA Case: JEDEC DO-201AD molded plastic over glass body Terminals: Plated axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.04 ounce, 1.12 grams MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. RGP RGP RGP RGP RGP RGP RGP SYMBOLS 30A 30B 30D 30G 30J 30K 30M UNITS Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current 0.375" (9.5mm) lead length at TA=55°C I(AV) 3.0 Amps Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) IFSM 125.0 Amps Maximum instantaneous forward voltage at 3.0A VF 1.3 Volts Maximum DC reverse current TA=25°C 5.0 at rated DC blocking voltage TA=125°C IR 100.0 µA Maximum full load reverse current, full cycle average 0.375" (9.5mm) lead length at TA=55°C IR(AV) 100.0 µA Maximum reverse recovery time (NOTE 1) trr 150 250 500 ns Typical junction capacitance (NOTE 2) CJ 60.0 pF Typical thermal resistance (NOTE 3) R ΘJA 20.0 °C/W Operating junction and storage temperature range TJ,TSTG -65 to +175 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted 4/98 0.210 (5.3) 0.190 (4.8) DIA. 0.052 (1.32) 0.048 (1.22) DIA. 1.0 (25.4) MIN. 0.375 (9.5) 0.285 (7.2) 1.0 (25.4) MIN. DO-201AD Dimensions in inches and (millimeters) *Glass-plastic encapsulation technique is covered by Patent No. 3,996,602 and brazed-lead assembly by Patent No. 3,930,306 ® |
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