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S3G Datasheet(PDF) 1 Page - General Semiconductor

Part # S3G
Description  SURFACE MOUNT RECTIFIER
PDF  2 Pages
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Manufacturer  GE [General Semiconductor]
Direct Link  http://www.vishay.com
Logo GE - General Semiconductor

S3G Datasheet(HTML) 1 Page - General Semiconductor

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S3A THRU S3M
SURFACE MOUNT RECTIFIER
Reverse Voltage - 50 to 1000 Volts
Forward Current - 3.0 Amperes
FEATURES
♦ Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
♦ For surface mount applications
♦ Low profile package
♦ Built-in strain relief,
ideal for automated placement
♦ Glass passivated chip junction
♦ High temperature soldering:
260°C/10 seconds at terminals
MECHANICAL DATA
Case: JEDEC DO-214AB molded plastic body over
passivated chip
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Weight: 0.007 ounce, 0.25 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
SYMBOLS
S3A
S3B
S3D
S3G
S3J
S3K
S3M
UNITS
Device marking code
SA
SB
SD
SG
SJ
SK
SM
Maximum recurrent peak reverse voltage
VRRM
50
100
200
400
600
800
1000
Volts
Maximum RMS voltage
VRMS
35
70
140
280
420
560
700
Volts
Maximum DC blocking voltage
VDC
50
100
200
400
600
800
1000
Volts
Maximum average forward rectified current
at TL=75°C (NOTE 3)
I(AV)
3.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed on
IFSM
100.0
Amps
rated load (JEDEC Method) TL=75°C
Maximum instantaneous forward voltage at 2.5A
VF
1.15
Volts
Maximum DC reverse current
TA=25°C
10.0
at rated DC blocking voltage
TA=125°C
IR
250.0
µA
Typical reverse recovery time (NOTE 1)
trr
2.5
µs
Typical junction capacitance (NOTE 2)
CJ
60.0
pF
Typical thermal resistance (NOTE 3)
R
ΘJA
47.0
R
ΘJL
13.0
°C/W
Operating junction and storage temperature range
TJ, TSTG
-55 to +150
°C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient and from junction to lead mounted on
P.C.B. with 0.3 x 0.3” (8.0 x 8.0mm) copper pad areas
4/98
0.006 (0.152)
0.012 (0.305)
0.030 (0.76)
0.060 (1.52)
0.008 (0.203)
0.305 (7.75)
0.320 (8.13)
0.260 (6.60)
0.280 (7.11)
0.079 (2.06)
0.103 (2.62)
0.220 (5.59)
0.245 (6.22)
0.126 (3.20)
0.114 (2.90)
MAX.
DO-214AB
MODIFIED J-BEND
Dimensions in inches and (millimeters)


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