STPS1L40-Y

Characteristics

Doc ID 18247 Rev 1

5/9

Figure 15.

Thermal resistance junction to ambient versus copper surface under each lead (SMB)

Figure 13.

Forward voltage drop versus

forward current

(typical values, low level)

Figure 14.

Thermal resistance junction to

ambient versus copper surface

under each lead (SMA)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

IFM(A)

VFM(V)

Tj = 125 °C

Tj = 25 °C

0

20

40

60

80

100

120

140

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Rth(j-a)(°C/W)

Scu(cm²)

SMA

Epoxy printed circuit board, FR4

copper thickness = 35 µm

0

20

40

60

80

100

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Scu(cm²)

Rth(j-a)(°C/W)

SMB

Epoxy printed circuit board, FR4

copper thickness = 35 µm