SL1011B145 datasheet(4/6 Pages) LITTELFUSE

4 / 6 page

Gas Discharge Tube (GDT) Products

Revised: June 28, 2010

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com for current information.

Customer should verify actual device performance in their speciﬁc applications.

SL1011A/B and SL1411A Series

Reﬂow Condition

Pb-free assembly

Pre Heat

-Temperature Min (T

s(min))

150°C

-Temperature Max (T

s(max))

200°C

-Time (Min to Max) (t

60 – 180 seconds

Average Ramp-up Rate (LiquidusTemp

L) to peak)

3°C/second max.

S(max) to TL - Ramp-up Rate

5°C/second max.

Reﬂow

-Temperature (T

L) (Liquidus)

217°C

-Temperature (t

60 – 150 seconds

PeakTemperature (T

260+0/-5 °C

Time within 5°C of Actual Peak

Temperature (t

10 – 30 seconds

Ramp-down Rate

6°C/second max.

Time 25°C to PeakTemperature (T

8 minutes max.

Do not exceed

260°C

Soldering Parameters - Reﬂow Soldering (Surface Mount Devices)

Time

TS(max)

TS(min)

time to peak temperature

(t 25ºC to peak)

Ramp-down

Ramp-up

Preheat

Critical Zone

TL to TP

Soldering Parameters - Wave Soldering (Thru-Hole Devices)

Soldering Parameters - Hand Soldering

Dwell Time

100

120

140

160

180

200

220

240

260

280

300

Time (Seconds)

Cooling Time

Preheat Time

Wave Parameter

Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

(Typical Industry Recommendation)

Temperature Minimum:

100

° C

Temperature Maximum:

150

° C

Preheat Time:

60-180 seconds

Solder PotTemperature:

280

° C Maximum

Solder DwellTime:

2-5 seconds

Recommended Process Parameters:

Solder Iron Temperature: 350° C +/- 5°C

Heating Time: 5 seconds max.

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