6

8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW135/6)

Solder Reflow Profile

Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.

Regulatory Information

The devices contained in this data sheet have been approved by the following organizations:

UL

Recognized under UL 1577, Component Recognition Program, File E55361.

CSA

Approved under CSA Component Acceptance Notice #5, File CA 88324.

IEC/EN/DIN EN 60747-5-5

(HCNW and Option 060/360/560 only)

1.00 ± 0.15

(0.039 ± 0.006)

7

° NOM.

12.30 ± 0.30

(0.484 ± 0.012)

0.75 ± 0.25

(0.030 ± 0.010)

11.00

(0.433)

5

6

7

8

4

3

2

1

11.23

± 0.15

(0.442 ± 0.006)

9.00 ± 0.15

(0.354 ± 0.006)

1.3

(0.051)

13.56

(0.534)

2.29

(0.09)

LAND PATTERN RECOMMENDATION

1.80 ± 0.15

(0.071 ± 0.006)

4.00

(0.158)

MAX.

1.55

(0.061)

MAX.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.

0.254

+ 0.076

- 0.0051

(0.010

+ 0.003)

- 0.002)

MAX.