Pad Assignment

Chip size: 2725 ´ 2780 (mm)

2

* The IC substrate should be connected to VDD in the PCB layout artwork.

Unit: mm

Pad No.

X

Y

Pad No.

X

Y

1

-1206.00

1159.50

17

762.00

-1190.50

2

-1206.00

994.50

18

962.00

-1190.50

3

-1206.00

661.70

19

1202.00

-1190.50

4

-1206.00

71.50

20

1202.00

-753.50

5

-1206.00

-159.50

21

1202.00

-335.50

6

-1206.00

-359.50

22

1202.00

-135.50

7

-1206.00

-624.50

23

1202.00

65.50

8

-1206.00

-824.50

24

1202.00

259.50

9

-1098.00

-1190.50

25

1202.00

537.00

10

-898.00

-1190.50

26

1078.00

1167.50

11

-633.00

-1190.50

27

812.00

1167.50

12

-433.00

-1190.50

28

631.00

1167.50

13

-168.00

-1190.50

29

447.00

1167.50

14

32.00

-1190.50

30

-59.00

1167.50

15

297.00

-1190.50

31

-259.00

1167.50

16

497.00

-1190.50

32

-966.00

1167.50

HT1350

2

June 28, 1999

1

17

2

18

3

19

4

20

5

21

6

22

7

23

8

24

9

25

10

26

11

27

12

28

13

29

14

30

15

31

16

32

(0, 0)

T EST 2

T EST 1

OS C 2

OS C 1

OU T 1 7

OU T 1 6

OU T 1 5

OU T 1 4

CO M 2

CO M 1

CP 3

CP 2

CP 1

ST EP