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HT818D0 Datasheet(PDF) 3 Page - Holtek Semiconductor Inc |
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HT818D0 Datasheet(HTML) 3 Page - Holtek Semiconductor Inc |
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3 / 14 page ![]() Pad Assignment Pad Coordinates Unit: mm Pad No. X Y 1 -914.50 1997.95 2 -914.50 1854.55 3 -914.50 1663.95 4 -987.90 -2023.45 5 -254.60 -1996.95 6 -18.90 -1996.95 7 411.90 -1996.95 8 674.70 -1996.95 9 806.10 -2027.55 10 937.90 -1996.95 11 912.80 1501.15 12 912.80 1639.75 13 912.80 1835.15 14 912.80 1978.75 15 709.50 1949.25 16 179.20 1949.25 17 22.00 1949.25 18 -156.40 1949.25 19 -734.20 1949.25 Chip size: 2270 ´ 4400 (mm)2 * The IC substrate should be connected to VSS in the PCB layout artwork. Pad Description Pad No. Pad Name I/O Internal Connection Description 1~3 KEY10~KEY12 I Pull-high Trigger key, low active. Key features such as debounce time, pull-high resistance and repeat are all by mask option. 4 VDD ¾¾ Positive power supply 5 AUD O PMOS Open Drain Voice output for driving an external transistor 6 OSC2 O ¾ Oscillator output pin 7 OSC1 I ¾ Oscillator input pin HT818D0 3 March 15, 2000 1 11 2 12 3 13 4 14 5 15 6 16 7 17 8 18 9 19 10 (0 , 0 ) KE Y1 0 KE Y1 1 KE Y1 2 KE Y1 KE Y2 KE Y3 KE Y4 |
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