MBR560S datasheet(3/4 Pages) SMC

3 / 4 page

SANGDEST

MICROELECTRONICS

Technical Data

Green Products

Data Sheet N1379, Rev. A

• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113

(86) 25-87123907

•

• FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •

MBR560S

Electrical Characteristics:

Characteristics

Symbol

Condition

Typ.

Max.

Units

Forward Voltage Drop

VF1

@ 5A, Pulse, TJ = 25 °C

0.62

0.67

VF2

@ 5A, Pulse, TJ = 125 °C

0.56

Reverse Current

IR1

@VR = rated VR

TJ = 25 °C

0.15

IR2

@VR = rated VR

TJ = 125°C

* Pulse Width < 300µs, Duty Cycle <2%

Thermal-Mechanical Specifications:

Characteristics

Symbol

Condition

Specification

Units

Max. Junction Temperature

-55 to +150

°C

Max. Storage Temperature

Tstg

-55 to +150

°C

Maximum Thermal

Resistance Junction to

Soldering Point

RθJS

DC operation

1.5

°C/W

Maximum Thermal

Resistance Junction to Case

RθJC

DC operation

2.3

°C/W

Approximate Weight

0.08

Case Style

TO-277B

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