HCPL-4200 datasheet(4/12 Pages) HP

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1-376

Absolute Maximum Ratings

(No Derating Required up to 70

°C)

Storage Temperature .................................................. -55

°C to +125°C

Operating Temperature ................................................. -40

°C to +85°C

Lead Solder Temperature .... 260

°C for 10 s (1.6 mm below seating plane)

Supply Voltage – VCC .............................................................. 0 V to 20 V

Average Input Current - II ........................................... -30 mA to 30 mA

Peak Transient Input Current - II ............................................... 0.5 A[1]

Enable Input Voltage – VE ................................................ -0.5 V to 20 V

Output Voltage – VO ........................................................ -0.5 V to 20 V

Average Output Current – IO ....................................................... 25 mA

Input Power Dissipation – PI ................................................... 90 mW[2]

Output Power Dissipation – PO ............................................. 210 mW[3]

Total Power Dissipation – P .................................................. 255 mW[4]

Infrared and Vapor Phase Reflow Temperature

(Option #300) .......................................... see Fig. 1, Thermal Profile

Recommended Operating Conditions

Parameter

Symbol

Min.

Max.

Units

Power Supply Voltage

VCC

4.5

Volts

Forward Input Current

ISI

2.0

(SPACE)

Forward Input Current

IMI

(MARK)

Operating Temperature

070

°C

Fan Out

TTL Loads

Logic Low Enable

VEL

0.8

Volts

Voltage

Logic High Enable

VEH

2.0

Volts

Voltage

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