HCPL-5401 datasheet(3/12 Pages) HP

3 / 12 page

1-526

VCC

GND

Functional Diagrams

8 Pin DIP

20 Pad LCCC

Through Hole

Surface Mount

1 Channel

2 Channels

Note: All DIP devices have common VCC and ground. LCCC (leadless ceramic chip carrier) package has isolated channels with

separate VCC and ground connections.

Outline Drawings

VCC

VO1

GND

VO2

GND1

VO2

VO1

VCC2

VCC1

GND2

20 Terminal LCCC Surface Mount, 2 Channels

8.70 (0.342)

9.10 (0.358)

4.95 (0.195)

5.21 (0.205)

1.78 (0.070)

2.03 (0.080)

1.02 (0.040) (3 PLCS)

4.95 (0.195)

5.21 (0.205)

8.70 (0.342)

9.10 (0.358)

1.78 (0.070)

2.03 (0.080)

0.51 (0.020)

0.64

(0.025)

(20 PLCS)

1.52 (0.060)

2.03 (0.080)

METALIZED

CASTILLATIONS (20 PLCS)

2.16 (0.085)

TERMINAL 1 IDENTIFIER

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

SOLDER THICKNESS 0.127 (0.005) MAX.

1.14 (0.045)

1.40 (0.055)

3.81 (0.150)

MIN.

4.32 (0.170)

MAX.

9.40 (0.370)

9.91 (0.390)

0.51 (0.020)

MAX.

2.29 (0.090)

2.79 (0.110)

0.51 (0.020)

MIN.

0.76 (0.030)

1.27 (0.050)

8.13 (0.320)

MAX.

7.36 (0.290)

7.87 (0.310)

0.20 (0.008)

0.33 (0.013)

7.16 (0.282)

7.57 (0.298)

NOTE: DIMENSIONS IN MILLIMETERS (INCHES).

8 Pin DIP Through Hole, 1 and 2 Channel

HCPL-5401 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard)

HCPL-5401 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard)

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