HI-SINCERITY

MICROELECTRONICS CORP.

Spec. No. : HE6801

Issued Date : 1995.11.17

Revised Date : 2002.10.24

Page No. : 1/3

HBAV70

HSMC Product Specification

HBAV70

SWITCHING DIODE

Description

The HBAV70 consists of two diodes in a plastic surface mount

package. The diodes are connected in series and the unit is

designed for high-speed switching application in hybrid thick and

thin-film circuits.

Features

• Small SMD Package (SOT-23)

• Ultra-high Speed

• Low Forward Voltage

• Fast Reverse Recovery Time

Absolute Maximum Ratings

• Maximum Temperatures

Storage Temperature ............................................................................................ -65 ~ +150

°C

Junction Temperature .................................................................................................... +150

°C

• Maximum Power Dissipation

Total Power Dissipation (Ta=25

°C) ................................................................................ 250 mW

• Maximum Voltages and Currents (Ta=25°C)

Reverse Voltage .................................................................................................................. 70 V

Forward Current ............................................................................................................. 200 mA

Repetitive Forward Current ............................................................................................ 500 mA

°C)

Characteristic

Symbol

Condition

Min

Max

Unit

Reverse Breakdown Voltage

V(BR)

IR=100uA

70

-

V

VF(1)

IF=1mA

-

715

mV

VF(2)

IF=10mA

-

855

mV

VF(3)

IF=50mA

-

1100

mV

Forward Voltage

VF(4)

IF=100mA

-

1300

mV

Reverse Current

IR

VR=70

-

5

uA

Total Capacitance

CT

VR=0, f=1MHz

-

1.5

pF

Reverse Recovery Time

Trr

IF=IR=10mA, RL=100

Ω

measured at IR=1mA, VR=5V

-15

nS

SOT-23