80960JA datasheet(35/63 Pages) INTEL

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Advance Information Datasheet

80960JA/JF/JD/JT 3.3 V Microprocessor

Table 12.

132-Lead PGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.08)

JC (Junction-to-Case)

0.7

CA (Case-to-Ambient) (No Heatsink)

CA (Case-to-Ambient) (Omnidirectional Heatsink)

96544

CA (Case-to-Ambient) (Unidirectional Heatsink)

86544

NOTES:

1. This table applies to a PGA device plugged into a socket or soldered directly into a board.

θJA = θJC + θCA

θJ-CAP = 5.6°C/W (approximate) (no heatsink)

θJ-PIN = 6.4°C/W (inner pins) (approximate) (no heatsink)

θJ-PIN = 6.2°C/W (outer pins) (approximate) (no heatsink)

θJ-CAP = 3°C/W (approximate) (with heatsink)

θJ-PIN = 3.3°C/W (inner pins) (approximate) (with heatsink)

θJ-PIN = 3.3°C/W (outer pins) (approximate) (with heatsink)

Table 13.

196-Ball MPBGA Package Thermal Characteristics

Thermal Resistance — °C/Watt

Parameter

Airflow — ft./min (m/sec)

(0)

200

(1.01)

400

(2.03)

600

(3.04)

800

(4.06)

1000

(5.08)

JC (Junction-to-Case)

TBD

CA (Case-to-Ambient) (No Heatsink)

TBD

CA (Case-to-Ambient) (Omnidirectional Heatsink)

TBD

CA (Case-to-Ambient) (Unidirectional Heatsink)

TBD

J-CAP

J-PIN

TBD

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