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CD4013BMS Datasheet(PDF) 8 Page - Intersil Corporation

Part # CD4013BMS
Description  CMOS Dual ‘D’-Type Flip-Flop
PDF  9 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Manufacturer  INTERSIL [Intersil Corporation]
Direct Link  http://www.intersil.com/cda/home
Logo INTERSIL - Intersil Corporation

CD4013BMS Datasheet(HTML) 8 Page - Intersil Corporation

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CD4013BMS
Chip Dimensions and Pad Layout
Dimension in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
FIGURE 8. TYPICAL MAXIMUM CLOCK FREQUENCY vs
SUPPLY VOLTAGE
FIGURE 9. TYPICAL POWER DISSIPATION vs FREQUENCY
Typical Performance Characteristics (Continued)
AMBIENT TEMPERATURE (TA) = +25
oC
tr, tf = 5ns
CL = 50pF
30
25
20
15
10
5
0
5
10
15
20
SUPPLY VOLTAGE (VDD) (V)
SUPPLY VOLTAGE
(VDD) = 15V
10V
10V
5V
AMBIENT TEMPERATURE (TA) = +25
oC
INPUT tr = tf = 20ns
1
2
4
6
8
10
2
4
6
8
102
2
4
6
8
103
2
4
6
8
104
102
24
6 8
103
24 6 8
104
24 6 8
105
24 6 8
106
24 6 8
INPUT FREQUENCY (ft) (HZ)
CL = 50pF
CL = 15pF
CONT
ACT
Y
OUR
LOCAL
SALES
OFFICE
FOR
METALLIZATION:
Thickness: 11k
Å
− 14kÅ, AL.
PASSIVATION:
10.4kÅ - 15.6k
Å, Silane
BOND PADS:
0.004 inches X 0.004 inches MIN
DIE THICKNESS:
0.0198 inches - 0.0218 inches



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