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CD4527BMS Datasheet(PDF) 11 Page - Intersil Corporation |
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CD4527BMS Datasheet(HTML) 11 Page - Intersil Corporation |
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11 / 11 page ![]() 7-1226 CD4527BMS Timing Diagram FIGURE 11. (SEE LOGIC DIAGRAM) Chip Dimensions and Pad Layout CLOCK Qa Qb Qc Qd R1 R2 R3 R4 OUTPUT (PIN 6) A ENABLED B ENABLED C ENABLED D ENABLED INH. OUT OUTPUT (PIN 6) PRESET NO. OF 1 PRESET NO. OF 2 PRESET NO. OF 3 PRESET NO. OF 4 PRESET NO. OF 5 PRESET NO. OF 6 PRESET NO. OF 7 PRESET NO. OF 8 PRESET NO. OF 9 012345678901234 Dimensions in parenthesis are in millimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch). METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches |
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